An Open-Source, Elastomer Interconnection-based
Connector for Flexible Neural Interfaces
Mating Dynamics (left) and Structural Breakdown (right) of the E-Link(256)
🔬 Interactive 3D Model: E-Link Headstage Integration
🔬 E-Link – 3D Interactive View
🔬 256Ch Customized Headstage – 3D Interactive View
📖 Overview
E-Link (Elastomer Interconnection-based connector) is an open-source, miniature pedestal connector system based on elastomer interconnection. It provides a robust, scalable interface for High-Density Soft Neural Interfaces, specifically engineered for chronic applications in freely moving animals.
[!NOTE] Key Innovation: The system integrates two high-density PCBs, an anisotropic elastomeric contact interface, and a lightweight pedestal housing into a fully integrated, headstage-ready solution.
📊 Quick Specifications
| Specification | E-Link(256)_V1.0 |
|---|---|
| Channel Count | 128 or 256 Channels (Single/Dual SPI Port support) |
| Total Mass | 6.6 g (with housing) 2.8 g (without housing) |
| Interconnect Type | Solderless Anisotropic Elastomer |
| Compatible Acquisition System | Intan Recording Controller (512ch/1024ch) Open-Ephys DAQ box NeuroNexus Smartbox OmniPlex DAQ box |
| Housing Material | 3D-Printed PEEK / Surgical Grade Resin |
✨ Key Features
🌍 Future Application Roadmap
2.8g Payload
6.6g Total
Multi-Array Scalable
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⚡ 256-Channel High-Density & Scalable Interface
Compact pedestal footprint supporting 256-ch acquisition. The elastomer-based design offers a clear scaling roadmap (up to 1024-ch) without increasing physical size. -
🔌 Zero-Force "Soft" Interconnect
By replacing rigid pins with Anisotropic Conductive Elastomer, the system shifts from "insertion" to "compression," eliminating common "bent pin" failure modes. -
🎯 Self-Aligning & High Tolerance
Features high-precision mechanical guidance with "Structural Redundancy," naturally forgiving minor manual misalignments without microscopic assistance. -
🛠️ Modular Maintenance & On-Demand Assembly
Separable "Sandwich" structure allows independent replacement of damaged modules and supports on-demand chip soldering to save research costs. -
🪶 Detachable Active Electronics
Easily separate heavy electronics from the implanted pedestal during rest, leaving only a lightweight passive interface to promote natural animal behavior. -
🐭 Optimized for Chronic In-Vivo Research
Lightweight core (2.8g) and low-profile design compatible with commutators, ensuring robust long-term recording in freely moving animals. -
🧪 Surgical-Grade Integration
Textured sidewalls for superior adhesion and customizable base curvature to match specific cranial profiles, creating a rock-solid isolation chamber.
⚡ Representative Spike Signal Acquisition (Simulation)
An interactive simulation demonstrating the acquisition of extracellular action potentials (spikes). The signals are modeled within a standard spike-band filter (300 Hz – 7.5 kHz) at a 30 kS/s sampling rate, reflecting the expected waveform morphology, thermal noise floor, and signal-to-noise ratio (SNR) during high-density recordings with the E-Link system.
🧩 System Components
| Component | Description |
|---|---|
| Pedestal Housing | 3D-printed/machined pedestal providing structural support and cranial fixation |
| Customized 256Ch Headstage | Form-factor optimized recording interface for high-density 128/256-channel signal acquisition |
| Foam Washer | Provides compliant compression to ensure uniform electrical contact across the elastomeric interface |
| Adapter PCB | High-density 4-layer PCB for routing signals from thin-film probes to headstage ball array pattern |
| Surgical Cap | Protective enclosure preserving electrical and mechanical integrity throughout chronic experiments |
🛠 Bill of Materials (BOM) of the headstage
Assembled 256-Channel Headstage (Top View)
4-Layer Routing Structure (Top to Bottom)
| Component | Description | Qty | Package | Notes |
|---|---|---|---|---|
| Amplifier IC | Intan RHD2164 | 4 | BGA | 💡 Tip: Ensure correct orientation |
| SPI Connector | Omnetics A7621 | 2 | - | 12-wire cable harness (32 AWG) |
| Resistors | Standard SMD | 7 | 0402 | LVDS Configuration |
| Capacitors | Standard SMD | 8 | 0603 | LVDS Configuration |
| Power LED | Green LED | 1 | 0402 | Power Indicator |
| Solder Balls | 0.4 mm Lead-free | ~300 | - | For BGA rework/assembly |
👥 Developers and Lab
- Tianyu Bai (Lead Designer)
- Gen Li, Ph.D.
- Hui Fang, Ph.D.
This project is developed by the MINE Lab at Dartmouth College.
📄 Publication
This work is currently under review at the IEEE Journal on Flexible Electronics (JFLEX).
The hardware designs and visual assets in this repository correspond directly to the system described in the submitted manuscript. To maintain the integrity of the peer-review process:
- Full Citation: A permanent link to the final paper will be updated here immediately upon formal acceptance.
-
Preprint/Full Paper: Coming Soon.
-
We welcome feedback and collaboration from the neuroengineering community!
- Inquiries: Thinking about using E-Link in your lab? We know setting up a new system can be tricky. If you have questions about the PCB design or 3D printing, drop us an email or open an issue. We’d love to help you get started!
- Support: support@ephys.tech
- Developer (Tianyu): tianyu@ephys.tech
📑 Citation & DOI
If you utilize these designs, code, or assets in your research, please cite this repository using the persistent DOI provided by Zenodo:
Current Reference:
T. Bai, et al., “E-Link GitHub Repository,” v1.0, MINE Lab, Dartmouth College, 2026.
🔗 Repository & Downloads
This project is fully open-source. Upon acceptance of the associated paper, the complete dataset comprising PCB fabrication files (Gerber/NC Drill), BOM, and Mechanical CAD will be accessible via the link below.
👇 Bookmark the repository for future downloads:
🤝 Acknowledgments
The developers gratefully acknowledge support from the NIH (R01MH139342) and the Dartmouth PhD Innovation Fellowship.
Special thanks to the members of the MINE Lab and the Thayer School of Engineering for their technical support and feedback throughout the development of the E-Link (256) system.
📜 License
Copyright © 2026 Tianyu Bai
This project is open-source and available under the MIT License. Click the badge below for full license details.
👇 🇨🇳 Chinese Version / 中文版 👇
易链
一种基于弹性导电体互连技术的
高密度柔性神经接口连接器
E-Link易链(256) 的插拔动态（左）和结构分解（右）
🔬 E-Link ：3D 交互式集成视图
🔬 E-Link 三维交互模型
🔬 256通道定制放大器 – 三维交互模型
📖 概览
E-Link易链，是一款基于弹性导电体互连技术（Elastomer Interconnection）的开源微型基座连接系统。它为柔性神经探针提供了稳固且可扩展的接口，专为自由活动动物的长期实验而优化设计
[!NOTE] 核心创新： 本连接器是一种完全一体化的 “即拧即用” 数据采集方案。该系统利用弹性导电介质连接高密度 PCB，并封装于轻量级基座中。其最大的突破在于实现了“零力插拔”，免去使用者用力插拔的动作，有效规避了高密度引脚连接器常见的断针和弯针风险。
📊 规格参数
| 规格项目 | E-Link(256)_V1.0 |
|---|---|
| 通道数 | 128或 256 通道 (支持单/双 SPI 端口) |
| 总质量 | 6.6 g (含外壳) 2.8 g (不含外壳) |
| 互连类型 | 免焊各向异性弹性体 |
| 兼容采集系统 | Intan Recording Controller (512ch/1024ch) Open-Ephys DAQ box NeuroNexus Smartbox OmniPlex DAQ box |
| 外壳材料 | 3D 打印 PEEK / 手术级树脂 |
✨ 核心特性
🌍 跨物种适用性展望
2.8g 载荷
6.6g 共计
可拓展矩阵
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⚡ 256通道高密度与可扩展接口
在有限基座占地面积内实现256通道数据采集。得益于弹性体互连的高集成度，该系统提供了清晰的扩展路径（可达1024通道），且不会增加额外的手术复杂度。 -
🔌 零插拔力，以柔克刚
利用各向异性导电弹性体取代传统刚性插针。通过“旋紧结构”将扭矩转化为均匀压力，从物理层面彻底规避了高密度连接器常见的断针、弯针等失效模式。 -
🎯 自对准与高容错连接
系统具备优异的机械限位与电气容错率。无需微米级精密对齐，只需简单旋紧即可实现稳定连接，极大降低了手动操作的难度和失败风险。 -
🛠️ 模块化维护与按需组装
采用“三明治”式分离结构（外壳、适配板、放大器板）。支持损坏模块的单独更换，并允许根据实验需求灵活焊接芯片，显著降低了科研成本。 -
🪶 电子模块即插即拆，释放头部负担
在非记录期间，有源电路可与底座快速分离，仅在颅骨留下极轻量的无源接口。这大幅减轻了动物的物理载荷，保障其在实验间隙的自然活动状态。 -
🐭 专为自由活动动物实验优化
核心组件仅重 2.8g。低剖面设计完美适配换向器 (Commutator)，有效管理线缆并确保动物在长期慢性实验中的自然行为，提升动物福利。 -
🧪 手术级一体化与解剖结构适配
侧壁纹理增强了与牙科水泥的附着力。基座底部的打印弧度可根据不同动物头部曲线进行定制调整，实现完美贴合，构建出全封闭的防护舱。
⚡ 代表性 Spike 信号采集示意
本交互模块为模拟演示，展示了系统在标准 Spike 频段（300 Hz – 7.5 kHz）下的胞外动作电位采集能力。该模型以 30 kS/s 的采样率，直观呈现了使用 E-Link 系统进行高密度记录时预期的波形动力学特征、系统热噪声底噪以及信噪比 (SNR) 表现。
🧩 系统组件
| 组件 | 描述 |
|---|---|
| 基座外壳 | 3D 打印/机械加工的基座，提供结构支撑和颅骨固定 |
| 定制化 256Ch 头部放大器 | 针对高密度 128/256 通道信号采集优化的记录接口 |
| 泡沫垫圈 | 提供柔性压缩层，确保弹性导电基体上方的电气接触均匀 |
| 转接PCB | 高密度 4 层 PCB，用于将信号从薄膜探针放大器的球栅阵列图案转换 |
| 手术保护盖 | 保护性外壳，在长期慢性实验中保持电气和机械完整性 |
🛠 放大器物料清单 (BOM)
已组装的 256 通道前置放大器 (顶视图)
| 组件 | 描述 | 数量 | 封装 | 备注 |
|---|---|---|---|---|
| 放大器 IC | Intan RHD2164 | 4 | BGA | 关键： 确保方向正确 |
| SPI 连接器 | Omnetics A7621 | 2 | - | 12 线线束 (32 AWG) |
| 电阻 | 标准贴片 | 7 | 0402 | LVDS 配置 |
| 电容 | 标准贴片 | 8 | 0603 | LVDS 配置 |
| 电源 LED | 绿色 LED | 1 | 0402 | 自检状态灯 |
| BGA锡球 | 0.4 mm 无铅 | 约300 | - | 用于 BGA 组装 |
👥 开发者与实验室
- 白天宇 (主导研发及设计)
- 李根
- 方辉教授
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本项目由达特茅斯学院的 MINE Lab团队开发。
📄 出版物
相关工作目前正在 IEEE Journal on Flexible Electronics (JFLEX) 审稿中。
本仓库中的硬件设计和视觉资产直接对应于投稿中描述的系统。
- 完整引用：正式录用后，最终论文的永久链接将立即在此处更新。
-
预印本/全文：即将推出。
-
🤝 我们诚挚欢迎神经工程科研同行的反馈与合作！
- 技术咨询：有意部署 E-Link易链？作为开发者深知从零搭建一套新系统往往伴随诸多挑战。无论您在 PCB 设计、3D 打印制造，还是系统组装方面遇到任何问题，都欢迎随时通过邮件与我们取得联系。将为您提供技术支持！
- 技术支持: support@ephys.tech
- 留言: tianyu@ephys.tech
📑 引用与 DOI
如果您在研究中使用了这些设计、代码或资产，需使用 Zenodo 提供的永久 DOI 引用本仓库：
当前引用源：
T. Bai, et al., “E-Link GitHub Repository,” v1.0, MINE Lab, Dartmouth College, 2026.
🔗 仓库与下载
本项目完全开源。相关论文录用后，包含 PCB 制造文件 (Gerber) 和 3D打印文件 的完整数据集将通过以下链接提供访问。
👇 欢迎收藏本仓库以便未来下载：
🤝 致谢
开发者感谢 美国国立卫生研究院 NIH R01MH139342 和 达特茅斯博士生创新奖学金 (Dartmouth PhD Innovation Fellowship) 的支持。
特别感谢 达特茅斯Thayer工学院 的相关成员在易链系统开发过程中提供的技术支持和反馈。
📜 许可协议
版权所有 © 2026 Tianyu Bai
本项目为开源硬件，在以下许可下可用。点击下方徽章查看完整许可详情。
- 硬件源文件 (KiCad/Gerbers/STL 文件)：在 MIT 许可 下授权。
- 文档、原理图 (PDF) 和图像：在 CC BY 4.0 国际许可 下授权。